導(dǎo)熱絕緣硅膠片的優(yōu)點(diǎn)及性能
The advantages and properties of silicon film thermal insulation
**降低散熱器以及散熱結(jié)構(gòu)件的工藝工差要求，彌合結(jié)構(gòu)工藝工差**
** reduce the radiator and radiating structure of the process requirements, bridge structure technology and difference**
導(dǎo)熱硅膠片厚度,軟硬度可根據(jù)設(shè)計(jì)的不同進(jìn)行調(diào)節(jié),因此在導(dǎo)熱通道中可以彌合散熱結(jié)構(gòu)，芯片等尺寸工差,降低對(duì)結(jié)構(gòu)設(shè)計(jì)中對(duì)散熱器件接觸面的工差要求,特別是對(duì)平面度,粗糙度的工差,目前行業(yè)內(nèi)高良率的散熱器加工尺寸工差為+/-0.25mm,平面度為0.15mm/30mmx30mm，如果提高加工精度則會(huì)在很大程度上提高產(chǎn)品成本，因此導(dǎo)熱硅膠片可以充分增大發(fā)熱體與散熱器件的接觸面積，降低了散熱器的生產(chǎn)成本。 除了傳統(tǒng)的PC行業(yè)，現(xiàn)在新的散熱方案就是去掉傳統(tǒng)的散熱器，將結(jié)構(gòu)件和散熱器統(tǒng)一成散熱結(jié)構(gòu)件。在PCB布局中將散熱芯片布局在背面，或在正面布局時(shí)，在需要散熱的芯片周圍開散熱孔，將熱量通過銅箔等導(dǎo)到PCB背面，然后通過導(dǎo)熱硅膠片填充建立導(dǎo)熱通道導(dǎo)到PCB下方或側(cè)面的散熱結(jié)構(gòu)件（金屬支架，金屬外殼），對(duì)整體散熱結(jié)構(gòu)進(jìn)行優(yōu)化，同時(shí)也降低整個(gè)散熱方案的成本.
Thermal conductivity of silica gel film thickness, hardness can be adjusted according to the different design, so it can bridge the radiating structure in the conduction channel, chip size tolerance, reduce the requirements on the contact surface of the radiator industry structure design, especially for flatness, roughness of the working poor, the processing size industrial radiator industry high yield difference is +/-0.25mm, the flatness is 0.15mm/30mmx30mm, if improve machining accuracy will increase the product cost to a great extent, the contact area of the thermal conductivity of silica gel film can increase the heating unit and the cooling device, reduce the production cost of the radiator. In addition to the traditional PC industry, now the new cooling solution is to remove the traditional radiator, the radiator structure and unified into the radiating structure. In the PCB layout, radiating chip layout on the back, or in front of the layout, opened with the heat dissipation holes around the need to heat the chip, through the copper conducting heat back to the PCB, and then through the heat conducting silicon film filling the establishment of thermal channel guide to the radiating structure below PCB or side (metal stents, metal shell), for optimization on the whole radiating structure, but also reduce the cooling solution cost.
